課程概述 Course Description
課程代碼 Course Code	中文課程名稱 Course Name(Chinese)	英文課程名稱 Course Name(English)	總學分數 Credits	總時數 Hours	冊別 Hours
02442	VLSI材料與製程導論	Introduction to VLSI	3	3
中文概述 Chinese Description	1.熱氧化、回火處理、爐管2.黃光設備、解析度、縱深比3.電漿產生及製程運用4.能量、深度、劑量控制5.乾式/濕式、解析度、選擇性6.CVD原理與應用7.金屬接觸、鍍層控制8.CMP原理與實務9.MOSFET元件製作
英文概述 English  Description	1. Thermal oxidation temperatures, the furnace tube 2. Photolithography equipment, resolution, depth to 3. The use of plasma production and process 4. Energy, depth and dose control 5. Dry / wet, resolution, selectivity 6.CVD Principles and Applications 7. metal contact, coating control 8.CMP Principles and Practices of 9.MOSFET device fabrication